EMI/EMC/RF shielding/conductive function for 19inch Enclosure

For some company who is specializing in Test and Measurement, Optical Analysis,High Power Optical Fiber Amplifier etc,Electromagnetic shielding design is important based on these instrument.Below are some step for EMI/EMC/RF shielding/conductive function for 19inch Enclosure.

Mechnical processing for EMI/EMC/RF shielding/conductive function

1.yellow area is engraved by laser to remove the anodizing,in order to make sure conductive
2.lf cutouts on end covers, remove the anodizing around the
holes for larger than 3-5mm from inside.
3.If a grounding stud is required inside the chassis, or a grounding screw hole is required outside, it is required to be
oxidized before riveting to ensure that the rivet is conductive to the stud and the shell.
4.The end faces of the side panels should have a margin before oxidation, and then be milled to the drawing size after oxidation.
5.The upper and lower covers require additional fixing screws to ensure continuity with the side panels and the front and rear panels.
Mill grooves at the joints between the side panels and the front and rear panels

conductive function for 19inch Enclosure

Mechnical processing for 19 inch rack mount enclosure

The first sequence: cutting raw materials. The raw materials are divided into profilesand plates(panels). The profiles are processed by a precision CNC sawing machine, and the plates are processed by a high-power laser.

The Second sequence:Three-axis CNC machining. if complexity of CNC machining is high, and the number of holes required is large.It is required to control the time and path of the tool when editing the CNC program, but
the technical difficulty is not high, and it is not necessary for four-axis
and five-axis machining, there will be a lot of surface processing for the entire chassis. The front and rear panels, bottom cover panels all need to be processed. The main thing is to ensure the assembly accuracy of the chassis.

The Third sequence: Surface Polishing Process.Both brushed and sandblast need to be polished to remove the burrs,processed by mechanical processing, and then brushed or sandblast.

Note: Especially the polish of the assembly dimensions must be strictly controlled.

The Fourth sequence: Anodizing, the uniformity of the color is required to be consistent, especially the plates and profiles are two materials.

Fifth sequence: Printing,CNC/UV/Silk/Laser printing etc

Summary

Yongucae has lot of rack mount enclosure to choose ,customization including size,cutouts,color,fasteners,printing,conductive/non conductive etc.More details please visit www.yongucase.com or mail export@yonggu-enclosure.com